Our PCB Assmbly DFM (Design for Manufacturability) analysis just does like "virtual assembly" before real assembly production, in order to find possible problems that may get exposed in real production. This helps to correct potential mistakes and make correct assembled boards quickly.
5. Solder paste Analysis
The Fiducial Analysis is a read-only action designed to check fiducial placement, exposure and spacing relative to other components and to each other. It acts upon the top or bottom signal layers, and refers to the corresponding component layer.
The Component Analysis is a read-only action intended to check component placement relative to other components or to drill and route features. It operates on the top or bottom layers, and refers to the corresponding component layer.Components can be classified by package type as well as component type. This can be useful in assembly analysis, and you may want to relate to package types when designing ERF (Engineering Rules File) models.
The Padstack Analysis action is intended to locate problems related to toeprint features (i.e. the toeprint padstack) and via features, regarding their status as “special” pad features and taking into account the component to which they belong. It operates on top or bottom layers, and refers to corresponding component layers.
The Test point Analysis is a read-only action intended to detect issues related to test points, i.e. pads having an attribute designating them as test points. It addresses issues such as accessibility to test points by probes and coverage on the board. It operates on top or bottom layers, and refers to the corresponding component layer.
Solder paste Analysis is a read-only action that includes tests to verify correct placement of solder paste on the board (solder paste should be on all SMD pads and only there), and proper overlap between solder paste and solder mask, between solder paste and copper layers.
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