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PCB Assembly DFM

Our PCB Assmbly DFM (Design for Manufacturability) analysis just does like "virtual assembly" before real assembly production, in order to find possible problems that may get exposed in real production. This helps to correct potential mistakes and make correct assembled boards quickly.

1. Fiducial Analysis

2. Component Analysis

3. Padstack Analysis

4. Test point Analysis

5. Solder paste Analysis

6. Pin to Pad Analysis

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1. Fiducial Analysis

The Fiducial Analysis is a read-only action designed to check fiducial placement, exposure and spacing relative to other components and to each other. It acts upon the top or bottom signal layers, and refers to the corresponding component layer.

2. Component Analysis

The Component Analysis is a read-only action intended to check component placement relative to other components or to drill and route features. It operates on the top or bottom layers, and refers to the corresponding component layer.

Components can be classified by package type as well as component type. This can be useful in assembly analysis, and you may want to relate to package types when designing ERF (Engineering Rules File) models.

3. Padstack Analysis

The Padstack Analysis action is intended to locate problems related to toeprint features (i.e. the toeprint padstack) and via features, regarding their status as “special” pad features and taking into account the component to which they belong. It operates on top or bottom layers, and refers to corresponding component layers.

4. Test point Analysis

The Test point Analysis is a read-only action intended to detect issues related to test points, i.e. pads having an attribute designating them as test points. It addresses issues such as accessibility to test points by probes and coverage on the board. It operates on top or bottom layers, and refers to the corresponding component layer.

5. Solder paste Analysis

Solder paste Analysis is a read-only action that includes tests to verify correct placement of solder paste on the board (solder paste should be on all SMD pads and only there), and proper overlap between solder paste and solder mask, between solder paste and copper layers.

6. Pin to Pad Analysis
Pin to Pad Analysis is a read-only action intended to detect issues related to the suitable placement of each component in regard to pin and pad location, size and orientation. It operates on the top or bottom layer, and refers to the corresponding component layer. Components can be classified by package type and/or lead form as well as component type. This can be useful in assembly analysis, particularly pin to pad analysis, and you may want to relate to package type and/or lead form when designing ERF models.

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