Layers
|
1-8
|
Material
|
FR-4
|
Board Thickness
|
.016”- 0.1”(0.4mm-2.5mm)
|
Copper Thickness
|
0.5 oz-2oz(18um-70um)
|
Board size
|
500x500mm
|
Min Tracing/Spacing
|
0.127mm (5mil)
|
Min Annular Ring
|
0.15mm(6mil)
|
Min drilling Hole diameter
|
0.25mm(10mil)
|
Min width of cutout (NPTH)
|
0.8mm
|
Min width of slot hole (PTH)
|
0.6mm
|
Solder Mask
|
LPI,different colors(Green,Black,White,Red,Yellow,Blue)
|
Silkscreen color
|
White,Black
|
Surface finish
|
HASL,Lead Free HASL,ENIG (1-5 micro inches)
|
Max.thickness of Au in ENIG
|
3-5 micro inches
|
Surface/Hole plating thickness
|
20-30um
|
Board thickness tolerance
|
+/-0.1mm ~ +/-10% of thickness of board
|
Board size tolerance
|
+/-0.1mm~+/-0.3mm
|
PTH hole size tolerance
|
+/-.003”(+/-0.08mm)~+/-.006”(+/-0.15mm)
|
NPTH hole size tolerance
|
+/-.002”(+/-0.05mm)
|
Copper thickness tolerance
|
0um ~ +20um
|
SM tolerance(LPI)
|
.003”(0.075mm)
|
SMD Pitch
|
0.2mm(8mil)
|
BGA Pitch
|
0.25mm(10mil)
|
Aspect Ratio
|
1:8 (hole size:board thickness)
|
Test
|
10V-250V,flying probe or testing fixture
|