Capability

Item	Manufacture Capability
Layers	1-8
Material	FR-4
Board Thickness	.016”- 0.1”(0.4mm-2.5mm)
Copper Thickness	0.5 oz-2oz(18um-70um)
Board size	500x500mm
Min Tracing/Spacing	0.127mm (5mil)
Min Annular Ring	0.15mm(6mil)
Min drilling Hole diameter	0.25mm(10mil)
Min width of cutout (NPTH)	0.8mm
Min width of slot hole (PTH)	0.6mm
Solder Mask	LPI，different colors(Green，Black，White，Red，Yellow，Blue)
Silkscreen color	White，Black
Surface finish	HASL，Lead Free HASL，ENIG (1-5 micro inches)
Max.thickness of Au in ENIG	3-5 micro inches
Surface/Hole plating thickness	20-30um
Board thickness tolerance	+/-0.1mm ~ +/-10% of thickness of board
Board size tolerance	+/-0.1mm~+/-0.3mm
PTH hole size tolerance	+/-.003”(+/-0.08mm)~+/-.006”(+/-0.15mm)
NPTH hole size tolerance	+/-.002”(+/-0.05mm)
Copper thickness tolerance	0um ~ +20um
SM tolerance(LPI)	.003”(0.075mm)
SMD Pitch	0.2mm(8mil)
BGA Pitch	0.25mm(10mil)
Aspect Ratio	1:8 (hole size:board thickness)
Test	10V-250V,flying probe or testing fixture