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Layers
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1-8
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Material
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FR-4
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Board Thickness
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.016”- 0.1”(0.4mm-2.5mm)
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Copper Thickness
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0.5 oz-2oz(18um-70um)
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Board size
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500x500mm
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Min Tracing/Spacing
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0.127mm (5mil)
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Min Annular Ring
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0.15mm(6mil)
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Min drilling Hole diameter
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0.25mm(10mil)
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Min width of cutout (NPTH)
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0.8mm
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Min width of slot hole (PTH)
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0.6mm
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Solder Mask
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LPI，different colors(Green，Black，White，Red，Yellow，Blue)
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Silkscreen color
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White，Black
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Surface finish
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HASL，Lead Free HASL，ENIG (1-5 micro inches)
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Max.thickness of Au in ENIG
|
3-5 micro inches
|
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Surface/Hole plating thickness
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20-30um
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Board thickness tolerance
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+/-0.1mm ~ +/-10% of thickness of board
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Board size tolerance
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+/-0.1mm~+/-0.3mm
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|
PTH hole size tolerance
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+/-.003”(+/-0.08mm)~+/-.006”(+/-0.15mm)
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NPTH hole size tolerance
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+/-.002”(+/-0.05mm)
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Copper thickness tolerance
|
0um ~ +20um
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|
SM tolerance(LPI)
|
.003”(0.075mm)
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SMD Pitch
|
0.2mm(8mil)
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BGA Pitch
|
0.25mm(10mil)
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Aspect Ratio
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1:8 (hole size:board thickness)
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Test
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10V-250V,flying probe or testing fixture
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